Samsung Techwin America, a global supplier of video surveillance and security products combining superior performance and value, is showcasing its support for A&E partners through outstanding project-implementation tools like BIM Revit. The software has enjoyed great popularity since its release and enhances the availability of the company’s IP portfolio on the popular building information modeling (BIM) web service Autodesk Seek. The BIM-ready IP camera lineup, including accessories, can be easily accessed inside of AutoDesk Revit®, AutoCAD® and on the Autodesk® Seek web site. Autodesk® Seek is a key configurator and systemisation tool enabling architects and engineers to easily access, preview and download 3D renderings of Samsung products.
“BIM technology holds enormous potential for improving video surveillance designs and implementations and is therefore a key tool for Samsung,” said Frank De Fina, Samsung’s Executive Vice President, North America. “The service gives users the information they need, in an interactive visual format, to select the right Samsung product solution for their project.”
The Autodesk® Seek free web service enables architects, engineers, and other design professionals to quickly discover, preview, and download branded and generic building information modeling (BIM) files, models, drawings, and product specifications directly into their active design sessions in Autodesk Revit® or AutoCAD® software. Users can view, rotate, zoom, and slice product models, and then download the accurate, lightweight files directly into the design session.
For example, using the Revit application, the designer selects a camera from the Samsung IP product portfolio and places the camera icon into the Autodesk Revit building diagram. Automatically, a 3D rendering is created allowing the designer to visualize the camera coverage area and then adjust the design for optimum performance.
Samsung Techwin IP products are available on Autodesk Seek, or through the Samsung website on the BIM Revit tab of the website.