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Teledyne FLIR's Boson+ IQ Kit Enhances Thermal Imaging

3 Sep 2025

Teledyne FLIR's Boson+ IQ Kit Enhances Thermal Imaging
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Summary is AI-generated, newsdesk-reviewed
  • Teledyne FLIR launches Boson+ IQ Kit for advanced thermal imaging development.
  • Kit features Qualcomm SoC achieving 50 TOPS with only 2.5 watts power.
  • Future-ready kit supports developers with MIPI interfaces and Prism software for AI.

Teledyne FLIR OEM, part of Teledyne Technologies Incorporated and the global pioneer in thermal imaging innovation, announced the launch of the Boson+ IQ Development Kit. 

The comprehensive solution combines reference hardware with Prism software, empowering integrators to rapidly develop edge AI capabilities using advanced thermal sensing across defense, security, and industrial platforms.

At the heart of the kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm Dragonwing QCS8550 system-on-chip (SoC), which delivers an industry-pioneering 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts.

Multicore architecture

Its multicore architecture supports Prism AI object detection models and Prism ISP features

Its multicore architecture supports Prism AI object detection models and Prism ISP features, including denoising and super resolution to provide exceptional image clarity in challenging environments.

“The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics,” said Jared Faraudo, Vice President of Product Management and Programs, Teledyne FLIR OEM. 

“By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we’re enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption.”

Flexibility and scalability

The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions

Designed for flexibility and scalability, the kit includes interface and carrier boards with three MIPI interfaces, allowing developers to integrate visible or other sensor types into their systems.

It also comes with the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support, providing a seamless development experience from prototype to deployment.

The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor.

Autonomous target detection

Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology. These software-enabled features can add powerful capabilities to mission-critical applications in defense, security, and industrial automation.

Experience the Boson+ IQ Development Kit in action at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, Sept. 9–12, one of the world’s premier defense and security exhibitions.

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Discover Teledyne FLIR's Boson+ IQ Development Kit, enhancing AI-driven thermal imaging for defense, security, and industrial platforms with exceptional image clarity and low power consumption.

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