Teledyne FLIR OEM, a division of Teledyne Technologies Incorporated, has introduced the Boson® SX8, an uncooled longwave infrared (LWIR) thermal camera module. Notably, it is the first to merge an 8-micron pixel pitch with SXGA (1280 × 1024) resolution while being compliant with NDAA standards and outside the scope of ITAR restrictions.
This significant reduction in pixel size enhances the module’s thermal performance, offering four times the resolution of high-volume, uncooled VGA (640 × 512) thermal camera modules, all within a similarly compact design.
Innovation for Defense and Industrial Applications
Engineered to meet the demands of defense and industrial sectors, the Boson SX8 is optimized for size, weight, and power (SWaP) constraints.
The camera module is crucial for a range of applications, including uncrewed aircraft systems (UAS), counter-UAS, perimeter security, handheld devices, seekers, as well as intelligence, surveillance, and reconnaissance (ISR) systems. It delivers capabilities that were previously associated with larger, more power-intensive cooled midwave infrared (MWIR) systems.
Supply-Chain Assurance
"By reducing pixel area by 55% compared to the standard 12-micron LWIR pixel format, Boson SX8 represents a transformational moment for thermal imaging," remarked Paul Clayton, President of Teledyne FLIR OEM.
"By pairing this advanced 8-micron pixel architecture with SXGA thermal resolution at full-rate production, we're giving customers greater situational awareness and longer effective range without compromising SWaP or supply-chain confidence."
Extended Range and Thermal Gradient Compensation
The Boson SX8 series expands its range capabilities with the new Boson SX8-CZ 15–75
The Boson SX8 series expands its range capabilities with the new Boson SX8-CZ 15–75, featuring a factory-integrated 5x continuous-zoom (CZ) lens.
This combines the camera module with a 15–75 mm lens, fully integrated and calibrated to function as a cohesive system, offering improved optical performance. Attributes like focus-through-zoom, thermal gradient compensation, and factory alignment ensure a single-source warranty, minimizing integration risks and speeding up market readiness.
Integration with Intelligent Software
Manufactured in the United States at high volume by a leading OEM thermal camera module provider, the Boson SX8 and its variant, Boson SX8-CZ 15–75, support smooth transition from development to full-scale production. They integrate seamlessly with Teledyne FLIR OEM’s Prism™ intelligent embedded software products, offering OEMs a low-risk deployment path.
The Boson SX8 product line is set to debut at Eurosatory 2026 in Paris, hosted at the Teledyne FLIR booth, allowing attendees to witness firsthand advancements in high-definition, SWaP-optimized thermal imaging technology.
