IDS Imaging Development Systems GmbH - Experts & Thought Leaders

IDS Imaging Development Systems expands its modular camera concept with a remote GigE PoE board (Daughterboard). It enables power supply and data transfer via a single cable, thereby facilitating the integration of motherboard board-level cameras from the GigE uEye LE and uEye SLE series. The motherboards are based on a flexible interface concept: Instead of a connector block, they feature a compact flat ribbon connector, allowing connection via a flexible cable to a remote interface electronics unit. PoE daughterboard This principle allows sensors and optics to be placed in the housing independently of the power supply and data connection – an advantage particularly for individual or space-critical product designs. "With the new PoE daughterboard, we are once again significantly simplifying the use of our smallest single-board cameras. Power supply and data transmission can now be achieved using a single cable with an RJ45 connector – this makes integration more convenient for our customers and opens up additional freedom for individual housing concepts," explains Marcus Rembold, Product Manager at IDS. Product overview: GigE uEye LE Rev.2/uEye SLE PoE Daughterboard Interface: Gigabit Ethernet with Power over Ethernet (PoE, IEEE 802.3af) Connector: RJ45 socket for single-cable operation (power supply + data transmission) Compatibility: Motherboard variants of the GigE uEye LE Rev. 2 and uEye SLE monitoring cameras Special features: Space-saving integration, reduced cabling, no additional power supply required Target applications: Customized housing concepts, space-critical designs, modular camera solutions The new GigE PoE Daughterboard opens up a wide range of possibilities for developers and integrators to create space-saving yet powerful camera systems.

Powder bed-based laser melting of metals (PBF-LB/M) is a key technology in additive manufacturing that makes it possible to produce highly complex and high-performance metal components with customized material and functional properties. This technology is used in numerous industries - from aerospace and medical technology to the automotive industry - and is considered groundbreaking for the manufacturing of the future. Advances in process monitoring and control are crucial to further increasing the quality, reproducibility and efficiency of this manufacturing process. Imaging components of the research project A key challenge is the precise analysis of the layer-by-layer laser melting process, as this has a decisive influence on component quality. As part of research into increasing process stability and efficiency, students and scientific staff at the Laser Application Center (LAZ) at Aalen University are conducting global, dynamic observation of the PBF-LB/M process.  The imaging components of the research project are two high-performance USB3 industrial cameras from IDS In the context of high-speed process control with temperature feedback, phenomena such as spatter and smoke formation, solidification behavior, and the safe movement of mechanical components during additive manufacturing are investigated. This is supplemented by a high-resolution, static analysis of the remelted component layer geometries and precise detection of potential defects in the powder layers in order to be able to draw well-founded conclusions about the resulting component quality. The imaging components of the research project are two high-performance USB3 industrial cameras from IDS Imaging Development Systems. Two IDS industrial cameras provide the necessary image information The two different tasks require different camera models. "We use a model from the USB3 uEye CP camera family for the global, dynamic observation of the PBF-LB/M process, such as splashes or the formation of smoke." "A USB3 uEye camera from the SE series is used for the static, high-resolution identification of anomalies within the powder layers and in the remelted component layer geometries," explains David Kolb, research associate at the LAZ. Requirements for the camera systems The requirements for the two IDS camera systems are different due to their areas of application in the PBF-LB/M The requirements for the two IDS camera systems are different due to their areas of application in the PBF-LB/M. "Since powder bed-based laser beam melting of metals is a highly dynamic additive manufacturing process in which the component is generated layer by layer, the following features were particularly important for global, dynamic monitoring: The camera must offer a resolution of more than 1000 x 1000 pixels and a frame rate of more than 100 fps, cover an image field of at least 100 mm x 100 mm and have a trigger port for video recordings," says David Kolb, explaining the choice of camera model. The selected U3-3040CP-C-HQ Rev.2.2 enables excellent image quality even in low light or when the camera should take pictures of fast-moving objects. The integrated IMX273 global shutter CMOS sensor from Sony's Pregius range scores particularly well for its image quality, high sensitivity and wide dynamic range. With a resolution of 1.58 megapixels (1456 x 1088 px), it achieves a frame rate of 251 frames per second - ideal for detailed video and image analyses of dynamic processes. Layer-by-layer PBF-LB/M process The video sequence/image shows the layer-by-layer PBF-LB/M process with different laser parameters, recorded with the U3-3040CP-C-HQ Rev.2.2 from IDS using the IDS peak software. "Depending on the setting of the industrial camera, various process properties such as material evaporation or the quantity and direction of splashes during the PBF-LB/M can be observed and quantified," says David Kolb, describing the application. "The knowledge gained from this provides us with important information to understand the laser-material interactions of the additive manufacturing process in greater depth and to be able to customize the manufacturing parameters depending on the material or, for example, the component geometry." New types of soft magnetic components The stator half-shell made of FeSi6.5, based on this, enables ideal adaption to the needs of transverse flux machines To determine the process parameters, cube-shaped components were additively manufactured and the global manufacturing process was analyzed using the USB3 uEye CP camera. This made it possible to identify optimum laser parameters with which new types of soft magnetic components for more efficient electric motors of the future can be produced from the difficult-to-process iron-silicon alloy with 6.5 wt.% silicon (FeSi6.5). The stator half-shell made of FeSi6.5 based on this enables ideal adaptation to the special requirements of transverse flux machines thanks to its optimized, three-dimensional magnetic flux guidance. Use of additive manufacturing technologies The high electrical resistance of the material and the design freedom of the PBF-LB/M allow a reduction in eddy current losses, increased power density and the integration of additional functions such as cooling structures.  Both the complex geometry and the brittle, soft magnetic material FeSi6.5 are almost impossible to produce or process using conventional manufacturing processes and require the use of additive manufacturing technologies. BSI technology The sensor must be able to detect geometric features below 40 µm in order to identify defects in the layers For static, high-resolution observation of powder layers or component layer geometries, on the other hand, the following camera properties are required in particular - in addition to a trigger port for single image recording: The sensor must be able to detect geometric features below 40 µm in order to identify defects in the layers and offer an image field of at least 100 mm × 100 mm and an image ratio that is as square as possible (1:1). This is exactly what the 20.36 megapixel (4512 x 4512 px) industrial camera U3-3990SE Rev.1.2 delivers. With the IMX541, it has a high-performance, extremely high-resolution, large-format 1.1" CMOS sensor from Sony's Pregius S series. The BSI technology ("Back Side Illuminated") used enables smaller pixels (2.74 µm) and a higher resolution, as well as improved quantum efficiency and sensitivity. User-friendly and flexibly integrable IDS cameras "Thanks to the particularly user-friendly and flexibly integrable IDS cameras, the necessary adjustments to the test setup could be implemented quickly and easily so that the USB3 uEye SE can be positioned specifically at a defined angle," explains David Kolb. The near-vertical observation of the individual powder component geometry layers will provide valuable insights The near-vertical observation of the individual powder component geometry layers will provide valuable insights into component quality and potential manufacturing defects once the final adjustments have been completed. In this way, crucial information about the properties of additively manufactured components can be obtained and used specifically to optimize the manufacturing processes. Outlook Research in the field of PBF-LB/M is essential for the development and processing of new material alloys and the production of performance-enhancing, sometimes multi-material component geometries. An in-depth understanding of the process helps to minimize defects and realize innovative designs that would not be possible using conventional production methods. The IDS cameras provide in-depth insights into the PBF-LB/M and thus make a valuable contribution to research, development and transfer (R&D&T) - for example, in the processing of new material alloys or the production of complex, application-optimized (multi-material) components. In future, artificial intelligence will be used to automatically analyze the dynamic and static observation of the PBF-LB/M. The aim is to gain an even better understanding of the highly dynamic laser-material interaction - such as the number and trajectory of spatter and the formation of process errors - and to further improve the additive manufacturing process in terms of resource efficiency and sustainability.

As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology‑pioneering company Micraft Systems Plus has developed two cutting-edge systems that meet these demands: the uLED Laser Soldering Machine and the HBM High-Accuracy Die Bonder. Both rely on industrial cameras from the USB3 uEye CP series from IDS Imaging Development Systems to deliver maximum accuracy, speed, and process control. These systems are already in high-volume use across the Asian electronics market. 20MP USB3 uEye CP cameras Application 1: Micro-LED Transfer & Laser Soldering with 20MP USB3 uEye CP cameras uLED Laser Soldering Machine is designed for high-speed, even of Micro-LEDs onto large-area substrates The uLED Laser Soldering Machine is designed for high-speed, precise of Micro-LEDs onto large-area substrates, including G4.5 and G6 glass panels. Laser soldering minimizes thermal and mechanical stress, which is essential when handling thousands of miniature components simultaneously. Firstly, the cameras are used to capture global reference marks for the preliminary alignment or to determine the rough position of the substrate in the machine coordinate system. This position data is then transmitted to the motion control system, which enables high-precision motion control on this basis - with a repeat accuracy of the coordinates of around ±1 µm. Dynamic rotation correction Once qualified, the chips are aligned and transferred with extreme precision. For fine adjustment, the cameras now capture fiducial marks, enabling real-time sub-micrometer alignment of the substrate and, if necessary, dynamic rotation correction.  The alignment results are then transmitted to the motion control system, which adjusts the stage position and angle to ensure each Micro-LED is perfectly matched to the target location. Initial inline visual inspection  The camera automatically moves to the relevant area, enabling operators to perform an initial inline visual inspection With a throughput rate of up to 10 million chips per hour, the system delivers both exceptional accuracy and high-volume efficiency, a key performance indicator (KPI) for scalable mass production. After bonding, the camera automatically moves to the relevant area, enabling operators to perform an initial inline visual inspection - such as verifying chip alignment, detecting potential tilt, and checking for physical damage or placement errors. This step is critical in mass transfer operations where yield optimization is essential. Advanced camera tasks in the micro LED process USB3 uEye CP cameras from IDS are the eyes of the uLED Laser Soldering Machine. Throughout the Micro LED workflow, the two integrated U3-3800CP-M-GL Rev.2.2 cameras from IDS support several key process steps: Donor wafer inspection (prior to transfer): Cameras detect defects such as cracks or missing units, ensuring only functional Micro LED chips are selected. Alignment and placement (during mass transfer): Cameras identify alignment marks and fiducials on substrates and dies. The results are transmitted to the motion control system for sub-micron placement accuracy. Post-transfer inspection: The cameras verify that each Micro LED has been precisely positioned and is free of tilt, damage, or misplacement. Rework and repair: When necessary, cameras guide pick-and-place systems to replace individual chips with precision. IMX183 Rolling Shutter CMOS Sensor Camera is therefore ideally suited for complex image analysis in applications such as surface “Exceptionally high-resolution images with low noise levels ensure the capture of even the smallest details,” emphasizes Damien Wang, Area Sales Manager APAC South East at IDS. The light-sensitive IMX183 Rolling Shutter CMOS Sensor from Sony's STARVIS series in the USB3 Vision industrial camera U3-3800CP Rev.2.2.provides outstanding image quality with a resolution of 20.44 MP (5536 x 3692) at 2.4 µm pixels and it delivers up to 19.8 fps. The camera is therefore ideally suited for complex image analysis in applications such as surface and display inspections. 12 MP USB3 uEye CP cameras Application 2: Die Bonding for High Bandwidth Memory (HBM) with 12MP USB3 uEye CP cameras The second system, the HBM High-Accuracy Die Bonder, is designed for advanced semiconductor packaging, especially HBM (High Bandwidth Memory) applications, where vertical stacking of dies requires micron-level precision. Here, two U3-3890CP-M-GL Rev.2.2 cameras from IDS locate the dies and bonding pads, provide precise coordinates to the placement unit, and enable accurate placement of each component. Inline inspection checks Inline checks every bond for placement accuracy, alignment integrity, and possible damage “The IDS camera is also mainly used for the alignment system in our HBM equipment. It identifies the positions of the chip and the target substrate and converts this information into coordinates for the motion control system to achieve precise positioning and alignment,” explains the manufacturer. The control unit uses these coordinates to guide placement with sub-micron accuracy, ensuring consistent results in high-density packaging. Inline inspection checks every bond for placement accuracy, alignment integrity, and possible damage. In high-density memory stacks, even minor misalignments can lead to electrical or thermal issues, making precise vision a must. Sensor performance for precise bonding The U3-3890CP Rev.2.2 is equipped with the rolling shutter CMOS sensor IMX226. The 12.00 MP sensor (4000 x 3000 px, pixel size 1.85 µm) from the Sony STARVIS series excels with exceptional light sensitivity and low noise levels. At full resolution, it delivers a frame rate of 33.2 fps. - perfect for fast, precise processes. Thanks to IDS camera integration, the system achieves repeatable accuracy and long-term process stability - ideal for complex 2.5D or 3D semiconductor packages. Vision technology at the core: IDS uEye CP Cameras To achieve the required speed and precision, both systems count on IDS’s uEye CP camera series To achieve the required speed and precision, both systems count on IDS’s uEye CP camera series. These compact (29 × 29 × 29 mm) cameras are built for industrial environments, featuring durable magnesium housing, Global Shutter CMOS sensors, and USB3 Vision connectivity. Thanks to the STARVIS series BSI ("back-side-illumination") technology, both sensors are ideally suited for tasks that require a perfect result even in low light conditions. Their high-resolution, low-noise imaging allows reliable detection of alignment marks, micro chip positions, solder bumps, and post-bonding joint quality, even at sub-micron scale. Crucially, their fast frame rate and minimal latency ensure seamless interaction with motion-control systems, providing real-time image data for rapid adjustments. These cameras also demonstrate strong thermal reliability, supporting continuous 24/7 operation essential in semiconductor factories. Integration and on-site calibration The standby mode reduces the power consumption in idle mode to a minimum and thus contributes to energy efficiency, making the industrial camera an environmentally friendly solution for long-term use. With the comprehensive software SDK from IDS, integration and on-site calibration become simple, making the uEye CP a foundational enabler for precision and throughput in packaging processes. Customer benefit: Scalable precision and increased efficiency The machine builder significantly enhanced process accuracy, repeatability, and reliability By integrating IDS vision technology into both platforms, the machine builder significantly enhanced process accuracy, repeatability, and reliability. Error rates fell, setup times shortened, and overall manufacturing efficiency improved - driving strong competitive advantage in both Micro‑LED displays and advanced semiconductor packaging. Both systems are already in use with pioneering manufacturers in Taiwan and Asia, showcasing how German-engineered vision technology seamlessly integrates with state-of-the-art automation to meet modern production demands. Outlook The market for semiconductor manufacturing – particularly in precision automation – is developing rapidly, and with it, the requirements for modern industrial cameras are also evolving. “Our customers are demanding high-resolution, compact, and absolutely reliable solutions more than ever before,” says Damien Wang. The trend toward higher resolution is a key driver of innovation: sharp, detailed images are essential for complex automation tasks. At the same time, stable performance under challenging operating conditions has become a fundamental requirement. “Many applications require continuous, uninterrupted operation. That’s why our focus is increasingly on cameras that perform reliably even in demanding environments,” emphasizes the responsible project manager from Micraft Systems Plus. Another trend is ongoing miniaturization. Industrial cameras with compact form factors are gaining importance, as space in modern systems is often limited – without any compromise in performance. To address these developments, the product portfolio is being strategically expanded and adapted to meet the growing technical demands.