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ASSA ABLOY Group, NXP, Samsung, Bosch Launch FiRa Consortium For Ultra-Wideband (UWB) interoperability
Recognizing the need for emerging applications to build on a strong foundation that supports interoperability among all categories of devices, four sponsor members – The ASSA ABLOY Group which includes HID Global, and NXP Semiconductors, Samsung Electronics, and Bosch, companies in access, secure connectivity and cellphone/CE device solutions – announced the launch of the FiRa Consortium. The new coalition is designed to grow the Ultra-Wideband (UWB) ecosystem so new use cases...
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